WAT
Probe Material: Rew Minimum Pad pitch: 100um Minimum Pad size: 40um*40um Testing Temperature: 25 ℃ ~125 ℃
LCD DRIVER
Probe Material: A+ Minimum Pad pitch: 20um Minimum Pad size: 13um*110um Testing Temperature: -40 ℃ ~125 ℃
MEMORY
Probe Material: Rew Minimum Pad pitch: 50um Minimum Pad size: 45um*45um Testing Temperature: -40 ℃ ~150 ℃
LOGIC
Probe Material: Rew Minimum Pad pitch: 50um Minimum Pad size: 45um*45um Testing Temperature: -40 ℃ ~150 ℃
J-Contacts
Uniquely designed‘J’shaped structure reduces the amount of pattern damage of load board surfaces. ● Suitable for high frequency test applications. ● Scrubbing action resists contamination,reduces the need for cleaning,and provides long term durability
U-Probe for DRAM
U-Probe for Flash Memory
Vertical-Probe
Vertical type probe card is suitable for high density and high speed logic and SoC wafer test. It’s flexible layout can meet to all pad arrangements, and is suitable for a fine pitch and high parallel testing. Moreover, single needle replacement is easy a
MEMS-SP
This probe card has spring type probe fabricated by MEMS process. It is suitable for flip chip devices such as microprocessor or Soc. Single pin replacement is easy with simple maintenance. Moreover, it’s suitable for high frequency direct docking test